The new generation of the reliable TruLaser 3030 and TruLaser 3040 combines innovative technology and high laser power with a new design concept and optimized operation, providing one cutting head for all sheet thicknesses:

  • High laser power
  • Compact installation option
  • New operating concept

The laser can handle a variety of cutting tasks. These range from micrometer-precise cutting joints in paper-thin semiconductor chips to quality cuts in 15-millimeter-thick steel.

In laser cutting, the laser beam generates very small to large holes in metals, plastics, paper and stone, without contact. Where the focused laser beam strikes the workpiece, it heats the material so extremely that it melts or even vaporizes.

Once it has completely penetrated the workpiece, the cutting process can start: The laser beam moves along the part contour, melting the material as it goes. Usually, a stream of gas blows the melted material downwards, out of the cut. The gap is barely wider than the focused laser beam itself.

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